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Publication type: Article in scientific journal
Type of review: Peer review (publication)
Title: Direct bonding and de‐bonding on demand of polystyrene and polyamide surfaces, treated with oxygen plasma
Authors: Günther, Roman
Caseri, Walter R.
Brändli, Christof
et. al: No
DOI: 10.1002/app.51753
Published in: Journal of Applied Polymer Science
Issue Date: Oct-2021
Publisher / Ed. Institution: Wiley
ISSN: 0021-8995
Language: English
Subjects: Klebstoffe; Adhäsion; De-Bonding; Oberflächenmodifizierung
Subject (DDC): 660: Chemical engineering
Abstract: Smooth polystyrene (PS) and polyamide 12 (PA 12) surfaces were produced via an injection molding process followed by a smoothing process and subsequently treated with O2 plasma to increase the number of polar groups capable of hydrogen bond formation on the surface. The presence of related groups was evident from X-ray photoelectron spectroscopy (XPS) and contact angle measurements. The sample topographies were investigated by atomic force microscopy (AFM). The plasma treatment allowed the joining of the substrates without adhesive by pressing the substrates together below or around the glass transition temperature. Notably, not only substrates of the same polymer but also PS and PA 12, which are incompatible, were joined with this method. The adhesion between the substrates was determined using a LUMifrac apparatus. The adhesion strength increased with increasing bonding temperature and when both substrates were plasma-treated, reaching adhesive strengths up to 5.5 ± 1.7 MPa. Remarkably, the joint substrates could be rapidly de-bonded on demand simply by treatment with water, and the separated substrates could be re-bonded by renewed plasma treatment.
Fulltext version: Published version
License (according to publishing contract): CC BY-NC-ND 4.0: Attribution - Non commercial - No derivatives 4.0 International
Departement: School of Engineering
Organisational Unit: Institute of Materials and Process Engineering (IMPE)
Appears in collections:Publikationen School of Engineering

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