Direct bonding and de‐bonding on demand of polystyrene and polyamide surfaces, treated with oxygen plasma

Günther, Roman; Caseri, Walter R.; Brändli, Christof

doi:10.1002/app.51753

Please use this identifier to cite or link to this item: https://doi.org/10.21256/zhaw-23293

Publication type:	Article in scientific journal
Type of review:	Peer review (publication)
Title:	Direct bonding and de‐bonding on demand of polystyrene and polyamide surfaces, treated with oxygen plasma
Authors:	Günther, Roman Caseri, Walter R. Brändli, Christof
et. al:	No
DOI:	10.1002/app.51753 10.21256/zhaw-23293
Published in:	Journal of Applied Polymer Science
Issue Date:	Oct-2021
Publisher / Ed. Institution:	Wiley
ISSN:	0021-8995 1097-4628
Language:	English
Subjects:	Klebstoffe; Adhäsion; De-Bonding; Oberflächenmodifizierung
Subject (DDC):	660: Chemical engineering
Abstract:	Smooth polystyrene (PS) and polyamide 12 (PA 12) surfaces were produced via an injection molding process followed by a smoothing process and subsequently treated with O2 plasma to increase the number of polar groups capable of hydrogen bond formation on the surface. The presence of related groups was evident from X-ray photoelectron spectroscopy (XPS) and contact angle measurements. The sample topographies were investigated by atomic force microscopy (AFM). The plasma treatment allowed the joining of the substrates without adhesive by pressing the substrates together below or around the glass transition temperature. Notably, not only substrates of the same polymer but also PS and PA 12, which are incompatible, were joined with this method. The adhesion between the substrates was determined using a LUMifrac apparatus. The adhesion strength increased with increasing bonding temperature and when both substrates were plasma-treated, reaching adhesive strengths up to 5.5 ± 1.7 MPa. Remarkably, the joint substrates could be rapidly de-bonded on demand simply by treatment with water, and the separated substrates could be re-bonded by renewed plasma treatment.
URI:	https://digitalcollection.zhaw.ch/handle/11475/23293
Fulltext version:	Published version
License (according to publishing contract):	CC BY-NC-ND 4.0: Attribution - Non commercial - No derivatives 4.0 International
Departement:	School of Engineering
Organisational Unit:	Institute of Materials and Process Engineering (IMPE)
Appears in collections:	Publikationen School of Engineering

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Günther, R., Caseri, W. R., & Brändli, C. (2021). Direct bonding and de‐bonding on demand of polystyrene and polyamide surfaces, treated with oxygen plasma. Journal of Applied Polymer Science. https://doi.org/10.1002/app.51753

Günther, R., Caseri, W.R. and Brändli, C. (2021) ‘Direct bonding and de‐bonding on demand of polystyrene and polyamide surfaces, treated with oxygen plasma’, Journal of Applied Polymer Science [Preprint]. Available at: https://doi.org/10.1002/app.51753.

R. Günther, W. R. Caseri, and C. Brändli, “Direct bonding and de‐bonding on demand of polystyrene and polyamide surfaces, treated with oxygen plasma,” Journal of Applied Polymer Science, Oct. 2021, doi: 10.1002/app.51753.

GÜNTHER, Roman, Walter R. CASERI und Christof BRÄNDLI, 2021. Direct bonding and de‐bonding on demand of polystyrene and polyamide surfaces, treated with oxygen plasma. Journal of Applied Polymer Science. Oktober 2021. DOI 10.1002/app.51753

Günther, Roman, Walter R. Caseri, and Christof Brändli. 2021. “Direct Bonding and de‐Bonding on Demand of Polystyrene and Polyamide Surfaces, Treated with Oxygen Plasma.” Journal of Applied Polymer Science, October. https://doi.org/10.1002/app.51753.

Günther, Roman, et al. “Direct Bonding and de‐Bonding on Demand of Polystyrene and Polyamide Surfaces, Treated with Oxygen Plasma.” Journal of Applied Polymer Science, Oct. 2021, https://doi.org/10.1002/app.51753.