Please use this identifier to cite or link to this item: https://doi.org/10.21256/zhaw-23293
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dc.contributor.authorGünther, Roman-
dc.contributor.authorCaseri, Walter R.-
dc.contributor.authorBrändli, Christof-
dc.date.accessioned2021-10-14T15:49:00Z-
dc.date.available2021-10-14T15:49:00Z-
dc.date.issued2021-10-
dc.identifier.issn0021-8995de_CH
dc.identifier.issn1097-4628de_CH
dc.identifier.urihttps://digitalcollection.zhaw.ch/handle/11475/23293-
dc.description.abstractSmooth polystyrene (PS) and polyamide 12 (PA 12) surfaces were produced via an injection molding process followed by a smoothing process and subsequently treated with O2 plasma to increase the number of polar groups capable of hydrogen bond formation on the surface. The presence of related groups was evident from X-ray photoelectron spectroscopy (XPS) and contact angle measurements. The sample topographies were investigated by atomic force microscopy (AFM). The plasma treatment allowed the joining of the substrates without adhesive by pressing the substrates together below or around the glass transition temperature. Notably, not only substrates of the same polymer but also PS and PA 12, which are incompatible, were joined with this method. The adhesion between the substrates was determined using a LUMifrac apparatus. The adhesion strength increased with increasing bonding temperature and when both substrates were plasma-treated, reaching adhesive strengths up to 5.5 ± 1.7 MPa. Remarkably, the joint substrates could be rapidly de-bonded on demand simply by treatment with water, and the separated substrates could be re-bonded by renewed plasma treatment.de_CH
dc.language.isoende_CH
dc.publisherWileyde_CH
dc.relation.ispartofJournal of Applied Polymer Sciencede_CH
dc.rightshttp://creativecommons.org/licenses/by-nc-nd/4.0/de_CH
dc.subjectKlebstoffede_CH
dc.subjectAdhäsionde_CH
dc.subjectDe-Bondingde_CH
dc.subjectOberflächenmodifizierungde_CH
dc.subject.ddc660: Technische Chemiede_CH
dc.titleDirect bonding and de‐bonding on demand of polystyrene and polyamide surfaces, treated with oxygen plasmade_CH
dc.typeBeitrag in wissenschaftlicher Zeitschriftde_CH
dcterms.typeTextde_CH
zhaw.departementSchool of Engineeringde_CH
zhaw.organisationalunitInstitute of Materials and Process Engineering (IMPE)de_CH
dc.identifier.doi10.1002/app.51753de_CH
dc.identifier.doi10.21256/zhaw-23293-
zhaw.funding.euNode_CH
zhaw.originated.zhawYesde_CH
zhaw.publication.statuspublishedVersionde_CH
zhaw.publication.reviewPeer review (Publikation)de_CH
zhaw.webfeedKlebstoffe und Polymere Materialiende_CH
zhaw.author.additionalNode_CH
zhaw.display.portraitYesde_CH
Appears in collections:Publikationen School of Engineering

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Günther, R., Caseri, W. R., & Brändli, C. (2021). Direct bonding and de‐bonding on demand of polystyrene and polyamide surfaces, treated with oxygen plasma. Journal of Applied Polymer Science. https://doi.org/10.1002/app.51753
Günther, R., Caseri, W.R. and Brändli, C. (2021) ‘Direct bonding and de‐bonding on demand of polystyrene and polyamide surfaces, treated with oxygen plasma’, Journal of Applied Polymer Science [Preprint]. Available at: https://doi.org/10.1002/app.51753.
R. Günther, W. R. Caseri, and C. Brändli, “Direct bonding and de‐bonding on demand of polystyrene and polyamide surfaces, treated with oxygen plasma,” Journal of Applied Polymer Science, Oct. 2021, doi: 10.1002/app.51753.
GÜNTHER, Roman, Walter R. CASERI und Christof BRÄNDLI, 2021. Direct bonding and de‐bonding on demand of polystyrene and polyamide surfaces, treated with oxygen plasma. Journal of Applied Polymer Science. Oktober 2021. DOI 10.1002/app.51753
Günther, Roman, Walter R. Caseri, and Christof Brändli. 2021. “Direct Bonding and de‐Bonding on Demand of Polystyrene and Polyamide Surfaces, Treated with Oxygen Plasma.” Journal of Applied Polymer Science, October. https://doi.org/10.1002/app.51753.
Günther, Roman, et al. “Direct Bonding and de‐Bonding on Demand of Polystyrene and Polyamide Surfaces, Treated with Oxygen Plasma.” Journal of Applied Polymer Science, Oct. 2021, https://doi.org/10.1002/app.51753.


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