Please use this identifier to cite or link to this item:
Title: Basic study on the evaluation of thermoplastic polymers as hot-melt adhesives for mixed-substrate joining
Authors : Ledergerber, Philipp
Balmer, Tobias
Bernet, Christian
Brändli, Christof
Schaible, Stefan
Published in : Open Journal of Applied Sciences
Volume(Issue) : 6
Pages : 579
Pages to: 592
Publisher / Ed. Institution : Scientific Research Publishing
Issue Date: 2016
License (according to publishing contract) : CC BY 4.0: Namensnennung 4.0 International
Type of review: Peer review (Publication)
Language : English
Subjects : Rheologie; Schmelzklebstoff; Mechanische Eigenschaft; Thermische Analyse
Subject (DDC) : 660: Chemical engineering
Abstract: A selection of 22 low-melting polymers was thermally and rheologically evaluated to be used as hot-melt adhesives in mixed-substrate joining samples. The choice of polymers was based on the published melting point. It was required to include a broad variety of different polymers backbones to study the influence of the different polymers comprehensively. A tool-box of widely applicable tests was developed to judge if a thermoplastic polymer is suitable for a hot-melt adhesive application. Melting temperature (onset, peak and offset temperature) and melting enthalpy were determined using standardized methods. Rheological methods were used to characterize the shear rate dependence and the flow behavior at the application temperature. The wetting behavior of the polymers was evaluated with contact angle measurements. The adhesive strength of the most promising candidates was analyzed using the Lumi Frac-adhesion method including the failure pattern.
Departement: School of Engineering
Organisational Unit: Institute of Materials and Process Engineering (IMPE)
Publication type: Article in scientific Journal
DOI : 10.4236/ojapps.2016.68057
ISSN: 2165-3917
Appears in Collections:Publikationen School of Engineering

Files in This Item:
File Description SizeFormat 
OJAppS_2016083113253762.pdf2.88 MBAdobe PDFThumbnail

Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.