|Title:||The art of adhesive formulation to meet the requirements of specific industrial applications|
|Authors :||Brändli, Christof|
|Conference details:||1st Rapperswil International Bonding Forum, Rapperswil, 27. Juni 2018|
|License (according to publishing contract) :||Not specified|
|Type of review:||Not specified|
|Subjects :||Adhesive formulation|
|Subject (DDC) :||660: Chemical engineering|
|Abstract:||Each adhesive application has special requirements. In a best case, a commercially available adhesive system can be purchased and applied without any restrictions. But in many cases, the adhesive has one or more technical drawbacks which need to be tackled by the adhesive developer or by the one who applies the adhesive. This presentation will give formulation insights and show how adhesive properties for specific technical requirements and application can be fulfilled. The art of adhesive formulation is heavily dependent on the polymer to be used for the adhesive. In order to give an overview about how specific functionalities and properties can be incorporated into the adhesive, this presentation will focus on three different adhesive systems. Polyolefins are the most straightforward polymer systems consisting only of carbon and hydrogen with fully saturated bonds. They are used as hot-melt adhesive systems. Besides showing general formulation insights, the presentation will focus on the technologies how to incorporate hydrophilicity which allows polyolefins to be used as adhesives for hydrophilic substrates such as wood and metals. Picture 1 shows aluminum substrates bonded by a modified polyolefin adhesive resulting in a cohesive failure. A major technical drawback of hot-melt systems is the low temperature resistance. Under temperature load, the polymeric structure melts or softens resulting in a loss of strength. A general requirement of many industrial applications is a high temperature resistance of such systems. Based on EVA, a widely used hot-melt adhesive, a high-temperature resistant formulation has been developed. Picture 2 shows a test set-up for the shear adhesion failure temperature (SAFT) measurement where a constant load is applied to a bonded specimen during a constantly increasing temperature. Processing the formulation during manufacturing and during application is demanding and needs to be fine-tuned precisely. An industrially important class of adhesives are reactive systems, particularly epoxy adhesives. Epoxy adhesive generally show a very high adhesion on hydrophilic substrates. For epoxy formulation developer, the curing behavior is a very critical topic which needs to be treated carefully. We will show how the curing behavior can be evaluated and screened and new concepts incorporated into the adhesive in order to fulfil the requirements for specific applications. On the example of a few adhesive systems, we will show some techniques behind adhesive formulations. Many more parameters such as fillers, rheology modifiers, inhibitors, stabilizers, color additives and many more are important for developing a successful formulation. Only the complete understanding of the interaction of all these additives leads to a successful formulation for technical applications.|
|Departement:||School of Engineering|
|Organisational Unit:||Institute of Materials and Process Engineering (IMPE)|
|Publication type:||Conference Other|
|Appears in Collections:||Publikationen School of Engineering|
Files in This Item:
There are no files associated with this item.
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.