Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Rejzek, Martin | - |
dc.date.accessioned | 2019-04-24T09:46:58Z | - |
dc.date.available | 2019-04-24T09:46:58Z | - |
dc.date.issued | 2014 | - |
dc.identifier.uri | https://digitalcollection.zhaw.ch/handle/11475/16829 | - |
dc.language.iso | en | de_CH |
dc.rights | Licence according to publishing contract | de_CH |
dc.subject.ddc | 363: Umwelt- und Sicherheitsprobleme | de_CH |
dc.subject.ddc | 620: Ingenieurwesen | de_CH |
dc.title | STPA pictured | de_CH |
dc.type | Konferenz: Poster | de_CH |
dcterms.type | Text | de_CH |
zhaw.departement | School of Engineering | de_CH |
zhaw.organisationalunit | Institut für Angewandte Mathematik und Physik (IAMP) | de_CH |
zhaw.conference.details | 3rd MIT STAMP Workshop, Boston, USA, 25-27 April 2014 | de_CH |
zhaw.funding.eu | No | de_CH |
zhaw.originated.zhaw | Yes | de_CH |
zhaw.publication.status | publishedVersion | de_CH |
zhaw.publication.review | Not specified | de_CH |
Appears in collections: | Publikationen School of Engineering |
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Rejzek, M. (2014). STPA pictured. 3rd MIT STAMP Workshop, Boston, USA, 25-27 April 2014.
Rejzek, M. (2014) ‘STPA pictured’, in 3rd MIT STAMP Workshop, Boston, USA, 25-27 April 2014.
M. Rejzek, “STPA pictured,” in 3rd MIT STAMP Workshop, Boston, USA, 25-27 April 2014, 2014.
REJZEK, Martin, 2014. STPA pictured. In: 3rd MIT STAMP Workshop, Boston, USA, 25-27 April 2014. Conference poster. 2014
Rejzek, Martin. 2014. “STPA Pictured.” Conference poster. In 3rd MIT STAMP Workshop, Boston, USA, 25-27 April 2014.
Rejzek, Martin. “STPA Pictured.” 3rd MIT STAMP Workshop, Boston, USA, 25-27 April 2014, 2014.
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