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https://doi.org/10.21256/zhaw-1897| Publication type: | Article in scientific journal |
| Type of review: | Peer review (publication) |
| Title: | Modal vector fitting : a tool for generating rational models of high accuracy with arbitrary terminal conditions |
| Authors: | Gustavsen, Bjørn Heitz, Christoph |
| DOI: | 10.21256/zhaw-1897 10.1109/TADVP.2008.927810 |
| Published in: | IEEE Transactions on Components, Packaging and Manufacturing Technology |
| Volume(Issue): | 31 |
| Issue: | 4 |
| Page(s): | 664 |
| Pages to: | 672 |
| Issue Date: | 2008 |
| Publisher / Ed. Institution: | IEEE |
| ISSN: | 2156-3950 |
| Language: | English |
| Subjects: | Signal processing |
| Subject (DDC): | 338: Production |
| Abstract: | This paper introduces a new approach for rational macromodeling of multiport devices that ensures high accuracy with arbitrary terminal conditions. This is achieved by reformulating the vector fitting (VF) technique to focus on eigenpairs rather than matrix elements. By choosing the least squares (LS) weighting equal to the inverse of the eigenvalue magnitude, the modal components are fitted with a relative accuracy criterion. The resulting modal vector fitting (MVF) method is shown to give a major improvement in accuracy for cases with a high ratio between the largest and smallest eigenvalue, although it is computationally more costly than VF. It is also shown how to utilize the impedance characteristics of the adjacent network in the fitting process. The application of MVF is demonstrated for a two-conductor stripline, a coaxial cable, and a transformer measurement. We also show a simplified procedure which achieves similar results as MVF if the admittance matrix can be diagonalized by a constant transformation matrix. The extracted model is finally subjected to passivity enforcement by the modal perturbation method, which makes use of a similar LS formulation as MVF for the constrained optimization problem. |
| URI: | https://digitalcollection.zhaw.ch/handle/11475/4393 |
| Fulltext version: | Published version |
| License (according to publishing contract): | Licence according to publishing contract |
| Departement: | School of Engineering |
| Organisational Unit: | Institute of Data Analysis and Process Design (IDP) |
| Appears in collections: | Publikationen School of Engineering |
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| File | Description | Size | Format | |
|---|---|---|---|---|
| 2008_Gustavsen_Modal vector fitting_IEEE Transactions.pdf | 505.91 kB | Adobe PDF |  View/Open |
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Gustavsen, B., & Heitz, C. (2008). Modal vector fitting : a tool for generating rational models of high accuracy with arbitrary terminal conditions. IEEE Transactions on Components, Packaging and Manufacturing Technology, 31(4), 664–672. https://doi.org/10.21256/zhaw-1897
Gustavsen, B. and Heitz, C. (2008) ‘Modal vector fitting : a tool for generating rational models of high accuracy with arbitrary terminal conditions’, IEEE Transactions on Components, Packaging and Manufacturing Technology, 31(4), pp. 664–672. Available at: https://doi.org/10.21256/zhaw-1897.
B. Gustavsen and C. Heitz, “Modal vector fitting : a tool for generating rational models of high accuracy with arbitrary terminal conditions,” IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 31, no. 4, pp. 664–672, 2008, doi: 10.21256/zhaw-1897.
GUSTAVSEN, Bjørn und Christoph HEITZ, 2008. Modal vector fitting : a tool for generating rational models of high accuracy with arbitrary terminal conditions. IEEE Transactions on Components, Packaging and Manufacturing Technology. 2008. Bd. 31, Nr. 4, S. 664–672. DOI 10.21256/zhaw-1897
Gustavsen, Bjørn, and Christoph Heitz. 2008. “Modal Vector Fitting : A Tool for Generating Rational Models of High Accuracy with Arbitrary Terminal Conditions.” IEEE Transactions on Components, Packaging and Manufacturing Technology 31 (4): 664–72. https://doi.org/10.21256/zhaw-1897.
Gustavsen, Bjørn, and Christoph Heitz. “Modal Vector Fitting : A Tool for Generating Rational Models of High Accuracy with Arbitrary Terminal Conditions.” IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 31, no. 4, 2008, pp. 664–72, https://doi.org/10.21256/zhaw-1897.
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