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Title: Analysis of phase-resolved partial discharge patterns of voids based on a stochastic process approach
Authors : Altenburger, Ruprecht
Heitz, Christoph
Timmer, Jens
Published in : Journal of Physics D : applied Physics
Volume(Issue) : 35
Issue : 11
Pages : 1149
Pages to: 1163
Publisher / Ed. Institution : Institute of Physics Publishing
Issue Date: 2002
Language : Englisch / English
Subjects : Data analysis; Statistical analysis; Stochastic modelling
Subject (DDC) : 500: Naturwissenschaften und Mathematik
621.3: Elektrotechnik, Elektronik
Abstract: A method is presented for the determination of physical discharge parameters for partial discharges (PD) of voids in solid insulation. Based on a recently developed stochastic theory of PD processes, a statistical analysis of a measured Phase-Resolved Partial Discharge (PRPD) pattern allows the de-termination of the relevant physical parameters like first electron availability or decay time con-stants for deployed charge carriers. These parameters can be estimated directly from the measured patterns without the need of performing simulations. Furthermore, error bounds for the parameter values can be given. The parameter estimation algorithm is based on the analysis of a contiguous region of the PRPD pattern where this region can be chosen nearly arbitrarily. Thus, even patterns with several active PD defects or patterns which are corrupted by noise can be analyzed. The method is applied to a sequence of patterns of a void in epoxy resin. The change in first elec-tron availability in the course of a day can be determined quantitatively from the data while the other physical parameters remain constant.
Departement: School of Engineering
Organisational Unit: Institut für Datenanalyse und Prozessdesign (IDP)
Publication type: Beitrag in wissenschaftlicher Zeitschrift / Article in scientific Journal
Type of review: Peer review (Publikation)
DOI : 10.1088/0022-3727/35/11/309
ISSN: 0022-3727
License (according to publishing contract) : Lizenz gemäss Verlagsvertrag / Licence according to publishing contract
Appears in Collections:Publikationen School of Engineering

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