Publication type: Conference other
Type of review: Peer review (abstract)
Title: Development and validation of a Eulerian-Lagrangian model to predict particle motion and deposition in electrostatic fields
Authors: Boiger, Gernot Kurt
Lienhard, Viktor
Buff, Vincent
Siyahhan, Bercan
et. al: No
Conference details: Invited Talk/Lecture at NIC National Institute of Chemistry, Ljubljana, Slovenia, 16 January 2020
Issue Date: 16-Jan-2020
Language: English
Subjects: Simulation; Coating; Multiphysics system; Euler Lagrange; CFD; OpenFoam
Subject (DDC): 530: Physics
Abstract: This invited talk focuses on a finite-volume based Eulerian-LaGrangian model created within OpenFoam®. Its purpose is to predict the behavior of particle clouds as well as particle deposition thicknesses on substrates under the influence of electro-static effects. The model resolves close-to-electrode effects as well as phenomena within the entire coating chamber. It considers fluid dynamic effects, particle inertia, gravity, electric- as well as mechanic particle-particle interaction, corona formation-, dynamic-particle-charging mechanisms and a coupling of particle motion to RANS based flow simulations. Resulting coating pattern predictions were experimentally validated. Qualitative and quantitative correspondence to measured coating -thicknesses and -patterns under the variation of i) applied voltage, ii) airflow rate, pistol-substrate iii) -distance and iv) –angle, can be demonstrated. Furthermore the software has been prepared such that it works on the cloud computing software KaleidoSim®, which enables the simultaneous browser-based running of hundreds of cases for large parameter studies.
Further description: Invited Talk held by G. Boiger at NIC National Institute of Chemistry - Kemijski Institute, Ljubljana, Slovenia, January 16th 2020
Fulltext version: Published version
License (according to publishing contract): Licence according to publishing contract
Departement: School of Engineering
Organisational Unit: Institute of Computational Physics (ICP)
Appears in collections:Publikationen School of Engineering

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