Please use this identifier to cite or link to this item: https://doi.org/10.21256/zhaw-17860
Title: Improving the filament weld-strength of Fused Filament Fabrication products through improved interdiffusion
Authors : Song Ko, Yee
Herrmann, Denis
Tolar, Oliver
Elspass, Wilfried J.
Brändli, Christof
et. al : No
Published in : Additive Manufacturing
Publisher / Ed. Institution : Elsevier
Issue Date: 29-Jul-2019
License (according to publishing contract) : CC BY-NC-ND 4.0: Attribution - Non commercial - No derivatives 4.0 International
Type of review: Peer review (publication)
Language : English
Subjects : 3d printing; FFF; Adhesion; Filament; Degree of healing
Subject (DDC) : 670: Manufacturing
Abstract: Fused Filament Fabrication (FFF) is a popular additive manufacturing technique where molten polymer filament is applied in a raster pattern, layer by layer, to obtain the work piece. A necessary consequence of this method is a pronounced mechanical anisotropy of the product; the interface between the filaments is weaker compared to the filament itself. The strength of this interface is governed by the reptation theory which postulates a more efficient interpenetration of polymeric surfaces with decreasing polymer viscosity. This relationship was utilized in this work to modify a polycarbonate-acrylonitrile butadiene styrene polymer blend to produce FFF work pieces with less mechanical anisotropy, independent of printer settings. The tensile strength ratio of the printed interface to bulk tensile strength could be increased from 41% to 95%. Though the absolute bulk tensile strength decreases slightly, this method presents an easy and effective way to address the mechanical problems inherent in the FFF-method.
Departement: School of Engineering
Organisational Unit: Institute of Materials and Process Engineering (IMPE)
Publication type: Article in scientific journal
DOI : 10.1016/j.addma.2019.100815
10.21256/zhaw-17860
ISSN: 2214-7810
2214-8604
URI: https://digitalcollection.zhaw.ch/handle/11475/17860
Restricted until : 2021-07-29
Appears in Collections:Publikationen School of Engineering

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