| Title: | STPA pictured |
| Authors : | Rejzek, Martin |
| Conference details: | 3rd MIT STAMP Workshop, Boston, USA, 25-27 April 2014 |
| Issue Date: | 2014 |
| License (according to publishing contract) : | Licence according to publishing contract |
| Type of review: | Not specified |
| Language : | English |
| Subject (DDC) : | 363: Environmental and security problems 620: Engineering |
| Departement: | School of Engineering |
| Organisational Unit: | Institute of Applied Mathematics and Physics (IAMP) |
| Publication type: | Conference Poster |
| URI: | https://digitalcollection.zhaw.ch/handle/11475/16829 |
| Appears in Collections: | Publikationen School of Engineering |
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