Title: STPA pictured
Authors : Rejzek, Martin
Conference details: 3rd MIT STAMP Workshop, Boston, USA, 25-27 April 2014
Issue Date: 2014
License (according to publishing contract) : Licence according to publishing contract
Type of review: Not specified
Language : English
Subject (DDC) : 363: Environmental and security problems
620: Engineering
Departement: School of Engineering
Organisational Unit: Institute of Applied Mathematics and Physics (IAMP)
Publication type: Conference Poster
URI: https://digitalcollection.zhaw.ch/handle/11475/16829
Appears in Collections:Publikationen School of Engineering

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