|Publication type:||Conference poster|
|Type of review:||Not specified|
|Title:||Printed flexible RFID label with temperature and humidity sensors|
|Authors :||Koller, M.|
de Rooij, N.F.
|Conference details:||Swiss ePrint 2013 - Conference on Printed Electronics and Functional Materials, Basel, 21-22 November 2013|
|Subjects :||RFID; Sensor; Plastic substrate; Flexible|
|Subject (DDC) :||004: Computer science|
|Abstract:||The present work consists of developing a flexible RFID label which integrates CMOS humidity and temperature sensors silicon chip using large-area printing processes and advanced chip-on-flex assembly processes. We report on the designing, elaboration and testing of the smart flexible RFID labels. The approach consists of the technology transfer of a UHF RFID Tag from classic rigid-PCB to a flexible polymeric substrate by printing techniques. The fabrication of antenna and PCB on flexible, plastic substrates (PET) was performed by means of roto-screen printing. The latter allows a high thermal transfer to the printed material, which is necessary for its sintering, while preserving the delicate substrate. Cost-effective and low temperature methods are also developed for the assembling of the silicon chip: methods involving conductive glues and anisotropic conductive adhesive or film and chips placement; fixation and electrical connections are done using a chip bonder and printing/dispensing or lamination of the conductive and adhesives materials.|
|Fulltext version :||Published version|
|License (according to publishing contract) :||Licence according to publishing contract|
|Departement:||School of Engineering|
|Organisational Unit:||Institute for Signal Processing and Wireless Communications (ISC)|
|Appears in Collections:||Publikationen School of Engineering|
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