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https://doi.org/10.21256/zhaw-5012| Publikationstyp: | Konferenz: Paper |
| Art der Begutachtung: | Keine Angabe |
| Titel: | Hera Object Storage : a seamless, automated multi-tiering solution on top of OpenStack Swift |
| Autor/-in: | Höppli, Remo Bohnert, Thomas Michael Militano, Leonardo |
| DOI: | 10.21256/zhaw-5012 10.1109/SC2.2018.00011 |
| Angaben zur Konferenz: | 8th IEEE International Symposium on Cloud and Service Computing (SC2 2018), Paris, France, 18-21 November 2018 |
| Erscheinungsdatum: | Nov-2018 |
| Verlag / Hrsg. Institution: | IEEE |
| ISBN: | 978-1-7281-0236-8 978-1-7281-0237-5 |
| Sprache: | Englisch |
| Schlagwörter: | Cloud Computing; Object Storage; OpenStack; Multi-tiering |
| Fachgebiet (DDC): | 004: Informatik |
| Zusammenfassung: | Over the last couple of decades, the demand for storage in the Cloud has grown exponentially. Distributed Cloud storage and object storage for the increasing share of unstructured data, are in high focus in both academic and industrial research activities. At the same time, efficient storage and the corresponding costs are often contrasting parameters raising a trade-off problem for any proposed solution. To this aim, classifying the data in terms of access probability became a hot topic. This paper introduces Hera Object Storage, a storage system built on top of OpenStack Swift that aims at selecting the most appropriate storage tier for any object to be stored. The goal of the multi-tiering storage we propose is to be automated and seamless, guaranteeing the required storage performance at the lowest possible cost. The paper discusses the design challenges, the proposed algorithmic solutions to the scope and, based on a prototype implementation it presents a basic proof-of-concept validation. |
| URI: | https://digitalcollection.zhaw.ch/handle/11475/14933 |
| Volltext Version: | Publizierte Version |
| Lizenz (gemäss Verlagsvertrag): | Lizenz gemäss Verlagsvertrag |
| Departement: | School of Engineering |
| Organisationseinheit: | Institut für Informatik (InIT) |
| Enthalten in den Sammlungen: | Publikationen School of Engineering |
Dateien zu dieser Ressource:
| Datei | Beschreibung | Größe | Format | |
|---|---|---|---|---|
| 2018_Höppli_Hera_object_storage.pdf | 866.78 kB | Adobe PDF |  Öffnen/Anzeigen |
Zur Langanzeige
Höppli, R., Bohnert, T. M., & Militano, L. (2018, November). Hera Object Storage : a seamless, automated multi-tiering solution on top of OpenStack Swift. 8th IEEE International Symposium on Cloud and Service Computing (SC2 2018), Paris, France, 18-21 November 2018. https://doi.org/10.21256/zhaw-5012
Höppli, R., Bohnert, T.M. and Militano, L. (2018) ‘Hera Object Storage : a seamless, automated multi-tiering solution on top of OpenStack Swift’, in 8th IEEE International Symposium on Cloud and Service Computing (SC2 2018), Paris, France, 18-21 November 2018. IEEE. Available at: https://doi.org/10.21256/zhaw-5012.
R. Höppli, T. M. Bohnert, and L. Militano, “Hera Object Storage : a seamless, automated multi-tiering solution on top of OpenStack Swift,” in 8th IEEE International Symposium on Cloud and Service Computing (SC2 2018), Paris, France, 18-21 November 2018, Nov. 2018. doi: 10.21256/zhaw-5012.
HÖPPLI, Remo, Thomas Michael BOHNERT und Leonardo MILITANO, 2018. Hera Object Storage : a seamless, automated multi-tiering solution on top of OpenStack Swift. In: 8th IEEE International Symposium on Cloud and Service Computing (SC2 2018), Paris, France, 18-21 November 2018. Conference paper. IEEE. November 2018. ISBN 978-1-7281-0236-8
Höppli, Remo, Thomas Michael Bohnert, and Leonardo Militano. 2018. “Hera Object Storage : A Seamless, Automated Multi-Tiering Solution on Top of OpenStack Swift.” Conference paper. In 8th IEEE International Symposium on Cloud and Service Computing (SC2 2018), Paris, France, 18-21 November 2018. IEEE. https://doi.org/10.21256/zhaw-5012.
Höppli, Remo, et al. “Hera Object Storage : A Seamless, Automated Multi-Tiering Solution on Top of OpenStack Swift.” 8th IEEE International Symposium on Cloud and Service Computing (SC2 2018), Paris, France, 18-21 November 2018, IEEE, 2018, https://doi.org/10.21256/zhaw-5012.
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