| Publikationstyp: | Beitrag in wissenschaftlicher Zeitschrift |
| Art der Begutachtung: | Peer review (Publikation) |
| Titel: | Encapsulation of ISFET sensor chips |
| Autor/-in: | Oelßner, W. Zosel, J. Guth, U. Pechstein, T. Babel, W. Connery, J.G. Demuth, Caspar Grote Gansey, M. Verburg, J.B. |
| DOI: | 10.1016/j.snb.2004.05.009 |
| Erschienen in: | Sensors and Actuators B: Chemical |
| Band(Heft): | 105 |
| Heft: | 1 |
| Seite(n): | 104 |
| Seiten bis: | 117 |
| Erscheinungsdatum: | 2005 |
| Verlag / Hrsg. Institution: | Elsevier |
| ISSN: | 0925-4005 |
| Sprache: | Englisch |
| Fachgebiet (DDC): | 540: Chemie |
| Zusammenfassung: | The encapsulation of ISFET sensor chips is a challenge to sensor technology and materials. Recently developed new packaging technologies enable reliable and cost effective chip encapsulation. By this, one of the serious problems, which had hindered the large-scale production and industrial application of ISFET sensors over three decades could be overcome now to a large extent. The paper reports both on ISFET encapsulation methods on laboratory level and advanced industrial production technologies. The influence of the packaging design on special applications and on the dynamic behaviour of the sensor is illustrated. Furthermore, sensor materials are characterised and various testing methods are described. |
| URI: | https://digitalcollection.zhaw.ch/handle/11475/9586 |
| Volltext Version: | Publizierte Version |
| Lizenz (gemäss Verlagsvertrag): | Lizenz gemäss Verlagsvertrag |
| Departement: | Life Sciences und Facility Management |
| Organisationseinheit: | Institut für Chemie und Biotechnologie (ICBT) |
| Enthalten in den Sammlungen: | Publikationen Life Sciences und Facility Management |
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Oelßner, W., Zosel, J., Guth, U., Pechstein, T., Babel, W., Connery, J. G., Demuth, C., Grote Gansey, M., & Verburg, J. B. (2005). Encapsulation of ISFET sensor chips. Sensors and Actuators B: Chemical, 105(1), 104–117. https://doi.org/10.1016/j.snb.2004.05.009
Oelßner, W. et al. (2005) ‘Encapsulation of ISFET sensor chips’, Sensors and Actuators B: Chemical, 105(1), pp. 104–117. Available at: https://doi.org/10.1016/j.snb.2004.05.009.
W. Oelßner et al., “Encapsulation of ISFET sensor chips,” Sensors and Actuators B: Chemical, vol. 105, no. 1, pp. 104–117, 2005, doi: 10.1016/j.snb.2004.05.009.
OELSSNER, W., J. ZOSEL, U. GUTH, T. PECHSTEIN, W. BABEL, J.G. CONNERY, Caspar DEMUTH, M. GROTE GANSEY und J.B. VERBURG, 2005. Encapsulation of ISFET sensor chips. Sensors and Actuators B: Chemical. 2005. Bd. 105, Nr. 1, S. 104–117. DOI 10.1016/j.snb.2004.05.009
Oelßner, W., J. Zosel, U. Guth, T. Pechstein, W. Babel, J.G. Connery, Caspar Demuth, M. Grote Gansey, and J.B. Verburg. 2005. “Encapsulation of ISFET Sensor Chips.” Sensors and Actuators B: Chemical 105 (1): 104–17. https://doi.org/10.1016/j.snb.2004.05.009.
Oelßner, W., et al. “Encapsulation of ISFET Sensor Chips.” Sensors and Actuators B: Chemical, vol. 105, no. 1, 2005, pp. 104–17, https://doi.org/10.1016/j.snb.2004.05.009.
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