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Please use this identifier to cite or link to this item: https://doi.org/10.21256/zhaw-22710
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dc.contributor.authorLockhart, R.-
dc.contributor.authorFriedrich, F.-
dc.contributor.authorBriand, D.-
dc.contributor.authorMargairaz, P.-
dc.contributor.authorSandoz, J.-P.-
dc.contributor.authorBrossard, J.-
dc.contributor.authorKeppner, H.-
dc.contributor.authorOlson, W.-
dc.contributor.authorDietz, T.-
dc.contributor.authorTardy, Y.-
dc.contributor.authorMeyer, H.-
dc.contributor.authorStadelmann, P.-
dc.contributor.authorRobert, C.-
dc.contributor.authorBoegli, A.-
dc.contributor.authorFarine, P.-A.-
dc.contributor.authorde Rooij, N. F.-
dc.contributor.authorBurger, J.-
dc.date.accessioned2021-06-23T12:04:49Z-
dc.date.available2021-06-23T12:04:49Z-
dc.date.issued2015-
dc.identifier.issn1387-2176de_CH
dc.identifier.issn1572-8781de_CH
dc.identifier.urihttps://digitalcollection.zhaw.ch/handle/11475/22710-
dc.descriptionErworben im Rahmen der Schweizer Nationallizenzen (http://www.nationallizenzen.ch)de_CH
dc.description.abstractThis work presents a planar, longitudinal mode ultrasonic scalpel microfabricated from monocrystalline silicon wafers. Silicon was selected as the material for the ultrasonic horn due to its high speed of sound and thermal conductivity as well as its low density compared to commonly used titanium based alloys. Combined with a relatively high Young's modulus, a lighter, more efficient design for the ultrasonic scalpel can be implemented which, due to silicon batch manufacturing, can be fabricated at a lower cost. Transverse displacement of the piezoelectric actuators is coupled into the planar silicon structure and amplified by its horn-like geometry. Using finite element modeling and experimental displacement and velocity data as well as cutting tests, key design parameters have been identified that directly influence the power efficiency and robustness of the device as well as its ease of controllability when driven in resonance. Designs in which the full- and half-wave transverse modes of the transducer are matched or not matched to the natural frequencies of the piezoelectric actuators have been evaluated. The performance of the Si micromachined scalpels has been found to be comparable to existing commercial titanium based ultrasonic scalpels used in surgical operations for efficient dissection of tissue as well as coaptation and coagulation of tissue for hemostasis. Tip displacements (peak-to-peak) of the scalpels in the range of 10-50 μm with velocities ranging from 4 to 11 m/s have been achieved. The frequency of operation is in the range of 50-100 kHz depending on the transverse operating mode and the length of the scalpel. The cutting ability of the micromachined scalpels has been successfully demonstrated on chicken tissue.de_CH
dc.language.isoende_CH
dc.publisherSpringerde_CH
dc.relation.ispartofBiomedical Microdevicesde_CH
dc.rightsLicence according to publishing contractde_CH
dc.subjectAnimalde_CH
dc.subjectChickende_CH
dc.subjectDissectionde_CH
dc.subjectElectric impedancede_CH
dc.subjectEquipment designde_CH
dc.subjectFinite element analysisde_CH
dc.subjectHemostasisde_CH
dc.subjectMaterial testingde_CH
dc.subjectReproducibility of resultsde_CH
dc.subjectSiliconde_CH
dc.subjectSwinede_CH
dc.subjectTransducerde_CH
dc.subjectUltrasonicsde_CH
dc.subjectSurgical instrumentde_CH
dc.subject.ddc610.28: Biomedizin, Biomedizinische Technikde_CH
dc.titleSilicon micromachined ultrasonic scalpel for the dissection and coagulation of tissuede_CH
dc.typeBeitrag in wissenschaftlicher Zeitschriftde_CH
dcterms.typeTextde_CH
zhaw.departementSchool of Engineeringde_CH
zhaw.organisationalunitInstitut für Mechatronische Systeme (IMS)de_CH
dc.identifier.doi10.1007/s10544-015-9981-6de_CH
dc.identifier.doi10.21256/zhaw-22710-
dc.identifier.pmid26153517de_CH
zhaw.funding.euNode_CH
zhaw.issue4de_CH
zhaw.originated.zhawYesde_CH
zhaw.pages.start77de_CH
zhaw.publication.statuspublishedVersionde_CH
zhaw.volume17de_CH
zhaw.publication.reviewPeer review (Publikation)de_CH
zhaw.author.additionalNode_CH
zhaw.display.portraitYesde_CH
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Lockhart, R., Friedrich, F., Briand, D., Margairaz, P., Sandoz, J.-P., Brossard, J., Keppner, H., Olson, W., Dietz, T., Tardy, Y., Meyer, H., Stadelmann, P., Robert, C., Boegli, A., Farine, P.-A., de Rooij, N. F., & Burger, J. (2015). Silicon micromachined ultrasonic scalpel for the dissection and coagulation of tissue. Biomedical Microdevices, 17(4), 77. https://doi.org/10.1007/s10544-015-9981-6
Lockhart, R. et al. (2015) ‘Silicon micromachined ultrasonic scalpel for the dissection and coagulation of tissue’, Biomedical Microdevices, 17(4), p. 77. Available at: https://doi.org/10.1007/s10544-015-9981-6.
R. Lockhart et al., “Silicon micromachined ultrasonic scalpel for the dissection and coagulation of tissue,” Biomedical Microdevices, vol. 17, no. 4, p. 77, 2015, doi: 10.1007/s10544-015-9981-6.
LOCKHART, R., F. FRIEDRICH, D. BRIAND, P. MARGAIRAZ, J.-P. SANDOZ, J. BROSSARD, H. KEPPNER, W. OLSON, T. DIETZ, Y. TARDY, H. MEYER, P. STADELMANN, C. ROBERT, A. BOEGLI, P.-A. FARINE, N. F. DE ROOIJ und J. BURGER, 2015. Silicon micromachined ultrasonic scalpel for the dissection and coagulation of tissue. Biomedical Microdevices. 2015. Bd. 17, Nr. 4, S. 77. DOI 10.1007/s10544-015-9981-6
Lockhart, R., F. Friedrich, D. Briand, P. Margairaz, J.-P. Sandoz, J. Brossard, H. Keppner, et al. 2015. “Silicon Micromachined Ultrasonic Scalpel for the Dissection and Coagulation of Tissue.” Biomedical Microdevices 17 (4): 77. https://doi.org/10.1007/s10544-015-9981-6.
Lockhart, R., et al. “Silicon Micromachined Ultrasonic Scalpel for the Dissection and Coagulation of Tissue.” Biomedical Microdevices, vol. 17, no. 4, 2015, p. 77, https://doi.org/10.1007/s10544-015-9981-6.


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