Publication type: | Article in scientific journal |
Type of review: | Peer review (publication) |
Title: | Model-based prediction of the ohmic resistance of metallic interconnects from oxide scale growth based on scanning electron microscopy |
Authors: | Linder, Markus Hocker, Thomas Holzer, Lorenz Friedrich, K. Andreas Iwanschitz, Boris Mai, Andreas Schuler, J. Andreas |
DOI: | 10.1016/j.jpowsour.2014.08.098 |
Published in: | Journal of Power Sources |
Volume(Issue): | 272 |
Page(s): | 595 |
Pages to: | 605 |
Issue Date: | 2014 |
Publisher / Ed. Institution: | Elsevier |
ISSN: | 0378-7753 1873-2755 |
Language: | English |
Subjects: | Scale growth rate law; Interconnect; Map; Solid oxide fuel cell (SOFC) |
Subject (DDC): | 530: Physics 621.3: Electrical, communications, control engineering |
Abstract: | The increase of ohmic losses caused by continuously growing Cr2O3 scales on metallic interconnects (MICs) is a major contribution to the degradation of SOFC stacks. Comparison of measured ohmic resistances of chromium- (CFY) and ferritic-based alloy (Crofer) MICs at 850°C in air with the growth of mean oxide scale thicknesses, obtained from SEM cross section images, reveals a non-trivial, non-linear relationship. To understand the correlation between scale evolution and resulting ohmic losses, 2D finite element (FE) simulations of electrical current distributions have been performed for a large number of real oxide scale morphologies. It turns out that typical morphologies favor nonhomogeneous electrical current distributions, where the main current flows over rather few “bridges”, i.e. local spots with relatively thin oxide scales. These current-“bridges” are the main reason for the non-linear dependence of ohmic losses on the corresponding oxide scale morphology. Combining electrical conductivity and SEM measurements with FE simulations revealed two further advantages: it permits a more reliable extrapolation of MIC-degradation data over the whole stack lifetime and it provides a method to assess the effective electrical conductivity of thermally grown Cr2O3 scales under stack operation. |
URI: | https://digitalcollection.zhaw.ch/handle/11475/1635 |
Fulltext version: | Published version |
License (according to publishing contract): | Licence according to publishing contract |
Departement: | School of Engineering |
Organisational Unit: | Institute of Computational Physics (ICP) |
Appears in collections: | Publikationen School of Engineering |
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Linder, M., Hocker, T., Holzer, L., Friedrich, K. A., Iwanschitz, B., Mai, A., & Schuler, J. A. (2014). Model-based prediction of the ohmic resistance of metallic interconnects from oxide scale growth based on scanning electron microscopy. Journal of Power Sources, 272, 595–605. https://doi.org/10.1016/j.jpowsour.2014.08.098
Linder, M. et al. (2014) ‘Model-based prediction of the ohmic resistance of metallic interconnects from oxide scale growth based on scanning electron microscopy’, Journal of Power Sources, 272, pp. 595–605. Available at: https://doi.org/10.1016/j.jpowsour.2014.08.098.
M. Linder et al., “Model-based prediction of the ohmic resistance of metallic interconnects from oxide scale growth based on scanning electron microscopy,” Journal of Power Sources, vol. 272, pp. 595–605, 2014, doi: 10.1016/j.jpowsour.2014.08.098.
LINDER, Markus, Thomas HOCKER, Lorenz HOLZER, K. Andreas FRIEDRICH, Boris IWANSCHITZ, Andreas MAI und J. Andreas SCHULER, 2014. Model-based prediction of the ohmic resistance of metallic interconnects from oxide scale growth based on scanning electron microscopy. Journal of Power Sources. 2014. Bd. 272, S. 595–605. DOI 10.1016/j.jpowsour.2014.08.098
Linder, Markus, Thomas Hocker, Lorenz Holzer, K. Andreas Friedrich, Boris Iwanschitz, Andreas Mai, and J. Andreas Schuler. 2014. “Model-Based Prediction of the Ohmic Resistance of Metallic Interconnects from Oxide Scale Growth Based on Scanning Electron Microscopy.” Journal of Power Sources 272: 595–605. https://doi.org/10.1016/j.jpowsour.2014.08.098.
Linder, Markus, et al. “Model-Based Prediction of the Ohmic Resistance of Metallic Interconnects from Oxide Scale Growth Based on Scanning Electron Microscopy.” Journal of Power Sources, vol. 272, 2014, pp. 595–605, https://doi.org/10.1016/j.jpowsour.2014.08.098.
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